Sunday 11 October 2026 Export all AMAT data to Excel Powerpack

Applied Materials, Inc.

AMAT Technology Semiconductor Equipment & Materials

Applied Materials, Inc.’s revenue for fiscal 2025 (year ended October 2025) was $28.4 billion, up 4.39% from fiscal 2024. In the quarter to July 2026, revenue grew 24.8%, EPS grew 43.5%, free cash flow grew 13.7% and total debt rose 4.50%, each against the same quarter a year earlier. Member of the S&P 500 and Nasdaq 100; dividend growth for ten consecutive years, revenue growth for five.

505.94 3.63 −0.71%
Market cap
$404.4B
P/E
43.4×
Fwd P/E
12.4×
Dividend yield
0.00%
F-score
6/9
Altman Z
11.17
Beneish M
−2.57
Dividend safety
96/100

Applied Materials, Inc. 10-Q filed Aug 20, 2026

Fiscal Q3 2026 · Period ended Jul 26, 2026 · Filed · accepted 4:01 PM ET · Document on sec.gov · Filing index

What changed

Part I, Item 2, Management’s Discussion and Analysis, against the 10-Q filed May 21, 2026: 3 added · 1 removed · 18 modified; 13 with only figures updated

  1. Modified · Overview

    The Semiconductor Systems segment is comprised primarily of capital equipment used to fabricate semiconductor chips. Spending by semiconductor customers, which include companies that operate in the foundry, logic, memory, and other semiconductor chip markets, is driven by demand for products such as smartphones, mobile devices, personal computers (PC), servers for artificial intelligence (AI) and data centers, automobiles, clean energy, storage, and other products, and the nature and timing of technological advances in fabrication processes. The growth of data and emerging end-market drivers such as AI, the internet of things, robotics and smart vehicles are also creating the next wave of growth for the industry. As a result, products within the Semiconductor Systems segment are subject to significant changes in customer requirements, including transitions to smaller dimensions, increasingly complex chip architectures, new materials and an increasing number of applications. Spending can also depend on customer facility readiness and timeline for installation of capital equipment at customer sites. Development efforts are focused on solving customers’ key technical challenges in patterning, transistor, interconnect, process control, and packaging performance.

21 more changes in this Item, word by word, in Powerpack.

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